creat by art - ideal for automated placement - reliable low cost construction utilizing molded plastic technique - high surge current capability - ul recognized file # e-326854 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm 50 100 200 400 600 800 1000 1200 1400 v v rms 35 70 140 280 420 560 700 840 980 v v dc 50 100 200 400 600 800 1000 1200 1400 v i f(av) a i 2 t a 2 s t j o c t stg o c document number: ds_d1311014 version: i13 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s,1% duty cycle typical thermal resistance r jl r ja 15 40 o c/w operating junction temperature range - 55 to +150 maximum dc reverse current t j =25 at rated dc blocking voltage t j =125 i r 2 500 a a rating for fusing (t<8.3ms) 10.3 maximum instantaneous forward voltage (note 1) i f = 2 a v f 1.15 1.30 v maximum dc blocking voltage maximum average forward rectified current 2.0 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 50 dbl 207g dbl 208g dbl 209g unit maximum repetitive peak reverse voltage maximum rms voltage weight: 0.38 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol dbl 201g dbl 202g dbl 203g dbl 204g dbl 205g dbl 206g dbl mechanical data case: molded plastic body polarity: polarity as marked on the body dbl201g thru dbl209g taiwan semiconductor glass passivated brid g e rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
part no. note 1: "x" defines voltage from 50v (dbl201g) to 1400v (dbl209g) part no. dbl207g dbl207g (ta=25 unless otherwise noted) document number: ds_d1311014 version: i13 suffix "g" dbl dbl207g c1g c1 g ratings and characteristics curves preferred p/n packing code green compound code dbl207g c1 dbl201g thru dbl209g taiwan semiconductor packing code green compound code package ordering information green compound description example 50 / tube packing c1 dbl20xg (note 1) c1 0 0.5 1 1.5 2 2.5 0 20 40 60 80 100 120 140 160 average forward current (a) ambient temperature ( o c) fig.1 forward current derating curve resistive or inductive load with heatsink 0 10 20 30 40 50 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave (jedec method) 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current (ua) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics tj=25 tj=125 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics dbl201g - dbl207g dbl208g - dbl209g
min max min max a 6.20 6.50 0.244 0.256 b 7.24 8.00 0.285 0.315 c 8.12 8.51 0.320 0.335 d 2.40 2.60 0.094 0.102 e 0.89 1.14 0.035 0.045 f 0.46 0.58 0.018 0.023 g 5.00 5.20 0.197 0.205 h 1.39 1.90 0.055 0.075 i 1.27 2.03 0.050 0.080 j 3.81 4.69 0.150 0.185 k 0.22 0.33 0.009 0.013 l 7.60 8.90 0.299 0.350 p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1311014 version: i13 marking diagram dbl201g thru dbl209g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 1 10 100 1 10 100 capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1311014 version: i13 dbl201g thru dbl209g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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